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Senior Principal Engineer in OSAT Package Technology Pre-Development (f/m/div)*

 Do you want to take on an exciting new challenge and help create next-generation semiconductor solutions? Do you want to work within global, cross-functional teams with opportunities to travel within Europe and Asia? State-of-the-art technology is being created every day at Infineon and we want you to be a part of it! Apply now to join our team in the UK as a Senior Principal Engineer in OSAT Package Technology Pre-Development and don’t miss the opportunity to grow and develop your skills working on a diverse range of innovation and technology development projects alongside enthusiastic and like-minded colleagues within both our internal development teams and our external assembly partners. As a Senior Principal Engineer in OSAT Package Technology Pre-Development, you will work closely with development teams to develop the most profitable packaging solutions, providing technical engineering support and leading teams.

In your new role you will:
  • Liaise with internal business units, development teams and OSATs to identify and develop profitable package platforms for MEMS and power semiconductor devices.
  • Provide technical and engineering support to OSAT Technology Pre-Development and Innovation projects. This involves:
    • Identifying industry packaging trends, working with the Business Units to develop new platforms and solutions. Driving innovation activities to demonstrate concepts and generating IP.
    • Driving task forces/focus teams/investigations to solve time critical problems across multiple package development platforms.
    • Consulting with IFX, OSATs and a network of external experts, generating hypotheses and experiments to identify cause(s) and solutions to complex problems. Prioritizing and coordinating activities, completing data analysis, drawing conclusions and implementing solutions.
    • Communicating key results and lessons learned to stakeholders, management and development teams.
    • Providing recommendations to top management levels on new opportunities.
    • Supporting continuous improvement and cost reduction activities, without compromising quality standards.
    • Mentoring team members and knowledge sharing.
  • Drive risk analysis and mitigation activities.
  • Lead DFMEA generation and RPN reduction activities.
  • Provide technical leadership to development teams on package design, process flow analysis and materials selection.
  • Liaise with OSATs, materials and equipment suppliers, understand and influence roadmaps and narrow down packaging solutions for multiple divisions.
  • Drive competitive analysis and IP generation activities.

 You are a technical expert who generates value with new ideas and solutions and aspires to outstanding results. With your hands-on attitude, creativity and excellent communication skills, you are able to quickly become acquainted with new topics and build lasting relationships with your internal and external counterparts. You are prepared to take risks consciously and courageously explore new paths. Your strong problem-solving skills enable you to remain focused on effective solutions, striving for continuous improvement. Thanks to your structured mindset, you are able to present results in an organized and concise manner. Furthermore, you are willing to mentor staff and share knowledge gained amongst the technical community both locally within the company and globally.

You are best equipped for this task if you have:

  • Degree level educated or higher (ideally Science or Engineering background).
  • Technical expertise in developing packages for Power Semiconductor and/or MEMS devices with at least 10 years of experience, a significant portion of which will have involved driving package development activities with OSATs.
  •  Knowledge and experience in managing die to package interactions.
  •  Experience in FMEA, risk analysis and mitigation activities, statistical process control, simulation and reliability techniques.
  •  Expertise in understanding semiconductor package materials, equipment and processes and have an established wide network of suppliers and contacts in the industry.
  •  Willingness to understand trends in packaging and work with business units to path-find and exploit new opportunities, driving and contributing to IP generation activities.
  •  At least 10 years of experience in driving problem-solving activities, including experience of leading global multifunctional teams, collaborating with internal and external experts and institutions, generating and prioritizing hypotheses, devising experiments, supporting trials on-site at OSATs, analyzing metrology and test data, coordinating failure analysis and simulation activities and presenting results to management/stakeholders.
  •  Fluency in English.

Driving decarbonization and digitalization. Together.

Infineon designs, develops, manufactures, and markets a broad range of semiconductors and semiconductor-based solutions, focusing on key markets in the automotive, industrial, and consumer sectors. Its products range from standard components to special components for digital, analog, and mixed-signal applications to customer-specific solutions together with the appropriate software.

The backend segments enable the development of comprehensive innovation across the entire value chain: starting with chip manufacturing, to wafer testing, preassembly, package development and development of new materials. The backend cluster combines the competencies for planning, productivity, innovation and quality, assembly and testing.

  •  The term gender in the sense of the General Equal Treatment Act (GETA) or other national legislation refers to the biological assignment to a gender group. At Infineon we are proud to embrace (gender) diversity, including female, male and diverse.

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Location: Redhill, Surrey, United Kingdom
Company: Infineon Technologies

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